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Conference Papers Year : 2016

Silicon: A flexible material for bendable electronics and sensors

Abstract

Directly crystallized deposited silicon at low temperature is shown to be the right material when bendable system including treatment electronics and sensing functions is needed. This is true particularly when process reproducibility, electrical and mechanical reliability of the devices are the most important parameters implying the success of the technology. Indeed, these parameters are the main issues when we need to go beyond the publication of a paper, towards actual commercial application. Electrical and mechanical performances of microcrystalline silicon thin film transistors and deformation sensors on 25 μm thick flexible plastics under high bending, still 0.75 mm curvature radius, are presented. These devices are fabricated directly on this substrate at a maximum temperature of 180°C. © 2016 IEEE.
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Dates and versions

hal-01484551 , version 1 (07-03-2017)

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Y. Kervran, K. Kandoussi, H. Dong, S. Janfaoui, N. Coulon, et al.. Silicon: A flexible material for bendable electronics and sensors. 31st Symposium on Microelectronics Technology and Devices, SBMicro 2016, Aug 2016, Horizonte, Brazil. ⟨10.1109/SBMicro.2016.7731313⟩. ⟨hal-01484551⟩
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