@inproceedings{kervran:hal-01484551, TITLE = {{Silicon: A flexible material for bendable electronics and sensors}}, AUTHOR = {Kervran, Y. and Kandoussi, K. and Dong, H. and Janfaoui, S. and Coulon, N. and Simon, C. and Jacques, E. and Mohammed-Brahim, T.}, URL = {https://univ-rennes.hal.science/hal-01484551}, BOOKTITLE = {{31st Symposium on Microelectronics Technology and Devices, SBMicro 2016}}, ADDRESS = {Horizonte, Brazil}, PUBLISHER = {{Institute of Electrical and Electronics Engineers Inc.}}, YEAR = {2016}, MONTH = Aug, DOI = {10.1109/SBMicro.2016.7731313}, KEYWORDS = {Deformation ; Flexible electronics ; Microelectronics ; Silicon ; Students ; Temperature ; Thin film transistors ; Commercial applications ; Flexible materials ; Flexible plastics ; Maximum temperature ; Mechanical performance ; Mechanical reliability ; Microcrystalline silicon thin films ; Reproducibilities ; Microcrystalline silicon}, HAL_ID = {hal-01484551}, HAL_VERSION = {v1}, }