Organometallic polyphosphorus and -arsenic ligands as linkers between pre-assembled linear CuI fragments - Université de Rennes Access content directly
Journal Articles Journal of the Chemical Society, Chemical Communications Year : 2015
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hal-01131140 , version 1 (13-03-2015)

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Martin Fleischmann, Luis Dütsch, Mehdi Elsayed Moussa, Andrea Schindler, Gábor Balázs, et al.. Organometallic polyphosphorus and -arsenic ligands as linkers between pre-assembled linear CuI fragments. Journal of the Chemical Society, Chemical Communications, 2015, 51 (14), pp.2893--2895. ⟨10.1039/C4CC09845E⟩. ⟨hal-01131140⟩
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