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Communication Dans Un Congrès Année : 2021

TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges

Résumé

This paper deals with a new compact and modular technology for power module, with integrated cooling to reduce the global weight/volume of power converters by optimizing the volume of the heat sink. It is based on the modular assembly of elementary switching cells. First the technology is introduced by only focusing on thermal aspects. Then the multiphysics design of elementary switching cells is described. Finally, various aspects concerning the fabrication and design of global power modules are discussed.
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Dates et versions

hal-03629431 , version 1 (04-04-2022)

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Wendpanga-Fadel Bikinga, Bachir Mezrag, Yvan Avenas, Jean-Luc Schanen, Jean-Michel Guichon, et al.. TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges. 3D-PEIM, Jun 2021, Osaka, Japan. pp.1-6, ⟨10.1109/3D-PEIM49630.2021.9497263⟩. ⟨hal-03629431⟩
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