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Article Dans Une Revue Optical Materials Express Année : 2022

Gallium phosphide-on-insulator integrated photonic structures fabricated using micro-transfer printing

Résumé

Gallium phosphide-on-insulator emerged recently as a promising platform for integrated nonlinear photonics due to its intrinsic material properties. However, current integration solutions, using direct die-to-wafer bonding, do not support spatially localized integration with CMOS circuits which induce a large and expensive footprint material need. Here we demonstrate the transfer of gallium phosphide layers to an oxidized silicon wafer using micro-transfer printing as a new approach for versatile future (hybrid) integration. Using this novel approach, we demonstrate as a proof of concept the fabrication of gallium phosphide-on-insulator ring resonators with Q-factors as high as 35,000.
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Dates et versions

hal-03967716 , version 1 (02-06-2023)

Identifiants

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Maximilien Billet, Luis Reis, Yoan Léger, Charles Cornet, Fabrice Raineri, et al.. Gallium phosphide-on-insulator integrated photonic structures fabricated using micro-transfer printing. Optical Materials Express, 2022, 12 (9), pp.3731. ⟨10.1364/OME.461146⟩. ⟨hal-03967716⟩
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